SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND) Declares Monthly Dividend of $0.15

SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND) announced a monthly dividend on Tuesday, November 3rd. Stockholders of record on Wednesday, November 4th will be given a dividend of $0.1535 per share on Thursday, November 5th. This represents a $1.84 annualized dividend and a dividend yield of 7.6%. The ex-dividend date of this dividend is Wednesday, November 4th. This is a 14.3% increase from SEI High Yield Bond & Alternative Credit ETF’s previous monthly dividend of $0.1343.

SEI High Yield Bond & Alternative Credit ETF Stock Performance

Shares of LEND stock traded down $0.04 on Wednesday, reaching $24.14. 54,989 shares of the stock were exchanged, compared to its average volume of 73,619. The business’s 50 day moving average price is $24.41 and its 200 day moving average price is $21.29. SEI High Yield Bond & Alternative Credit ETF has a twelve month low of $23.95 and a twelve month high of $25.29.