Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC – Get Free Report) announced a quarterly dividend on Thursday, August 27th. Shareholders of record on Thursday, September 17th will be paid a dividend of 0.205 per share by the semiconductor company on Wednesday, October 7th. This represents a c) dividend on an annualized basis and a yield of 1.0%. The ex-dividend date of this dividend is Thursday, September 17th.
Kulicke and Soffa Industries has increased its dividend payment by an average of 0.1%annually over the last three years and has increased its dividend annually for the last 7 consecutive years. Kulicke and Soffa Industries has a payout ratio of 53.6% meaning its dividend is sufficiently covered by earnings. Equities research analysts expect Kulicke and Soffa Industries to earn $4.96 per share next year, which means the company should continue to be able to cover its $0.82 annual dividend with an expected future payout ratio of 16.5%.
Kulicke and Soffa Industries Stock Down 0.2%
Shares of NASDAQ KLIC traded down $0.21 during midday trading on Thursday, reaching $84.67. 601,348 shares of the company were exchanged, compared to its average volume of 884,508. The stock’s 50-day moving average price is $103.83 and its 200-day moving average price is $90.34. The stock has a market cap of $4.43 billion, a P/E ratio of 39.02 and a beta of 1.67. Kulicke and Soffa Industries has a one year low of $35.02 and a one year high of $135.80.
About Kulicke and Soffa Industries
Kulicke & Soffa Industries (NASDAQ:KLIC) is a global supplier of semiconductor and LED assembly equipment. The company specializes in the design, development and manufacture of advanced die bonding, wire bonding, flip-chip bumping and wafer-level packaging systems. Its solutions support a wide range of applications in consumer electronics, automotive, communications and other high-growth segments within the semiconductor and LED industries.
Key products include precision wire bonders for microelectronic packaging, die attach systems for chip placement, flip-chip bonders for advanced packaging architectures and LED packaging platforms that enable high-volume production of automotive and general-illumination LEDs.
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