BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) was the target of a significant increase in short interest in the month of July. As of July 15th, there was short interest totaling 5,466 shares, an increase of 86.9% from the June 30th total of 2,924 shares. Based on an average trading volume of 21,611 shares, the days-to-cover ratio is presently 0.3 days. Currently, 0.0% of the shares of the company are short sold.
Analyst Upgrades and Downgrades
A number of equities research analysts recently commented on BESIY shares. Zacks Research downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, June 26th. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, May 19th. Finally, Deutsche Bank Aktiengesellschaft reissued a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. Five research analysts have rated the stock with a Buy rating and four have issued a Hold rating to the stock. According to data from MarketBeat.com, the stock presently has an average rating of “Moderate Buy”.
Check Out Our Latest Analysis on BESIY
BE Semiconductor Industries Stock Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last issued its earnings results on Thursday, July 23rd. The technology company reported $1.29 earnings per share for the quarter, missing the consensus estimate of $1.30 by ($0.01). BE Semiconductor Industries had a return on equity of 51.09% and a net margin of 28.42%.The company had revenue of $290.52 million for the quarter, compared to analyst estimates of $285.58 million. Equities research analysts predict that BE Semiconductor Industries will post 4.83 earnings per share for the current fiscal year.
About BE Semiconductor Industries
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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