BE Semiconductor Industries NV (OTCMKTS:BESIY) Sees Large Growth in Short Interest

BE Semiconductor Industries NV (OTCMKTS:BESIY) was the recipient of a significant growth in short interest in October. As of October 15th, there was short interest totaling 2,511 shares, a growth of 423.1% from the September 30th total of 480 shares. Based on an average daily volume of 25,823 shares, the short-interest ratio is currently 0.1 days. Currently, 0.0% of the company’s shares are sold short.

Analysts Set New Price Targets

Several equities research analysts have weighed in on the stock. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, September 8th. Zacks Research lowered shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, September 25th. UBS Group lowered shares of BE Semiconductor Industries from a “buy” rating to a “sell” rating in a report on Wednesday, October 7th. Finally, Berenberg Bank upgraded shares of BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research report on Tuesday, August 4th. One investment analyst has rated the stock with a Strong Buy rating, four have assigned a Buy rating, three have given a Hold rating and one has given a Sell rating to the stock. Based on data from MarketBeat.com, the stock has a consensus rating of “Moderate Buy”.

BE Semiconductor Industries Trading Up 0.7%

BESIY opened at $163.27 on Tuesday. The stock has a market capitalization of $11.84 billion, a P/E ratio of 53.53 and a beta of 1.99. BE Semiconductor Industries has a 12 month low of $140.07 and a 12 month high of $374.33. The firm’s fifty day simple moving average is $212.95 and its 200 day simple moving average is $246.25. The company has a current ratio of 4.28, a quick ratio of 3.73 and a debt-to-equity ratio of 0.60.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries N.V. (BESI) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to package semiconductor devices after wafer fabrication, helping customers assemble, connect, protect and test chips for use in electronic products.

BESI’s product portfolio includes die-attach equipment, packaging systems, molding equipment and singulation systems. Its technologies support applications such as advanced semiconductor packaging, flip-chip assembly, thermo-compression bonding and hybrid bonding, which are used in products requiring higher performance, smaller dimensions and improved power efficiency.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI serves semiconductor manufacturers and assembly and test providers worldwide.