Taiwan Semiconductor Manufacturing Company Ltd. (NYSE:TSM – Get Free Report) announced a quarterly dividend on Tuesday, February 10th. Investors of record on Thursday, June 11th will be paid a dividend of 0.9503 per share by the semiconductor company on Thursday, July 9th. This represents a c) dividend on an annualized basis and a dividend yield of 1.0%. The ex-dividend date of this dividend is Thursday, June 11th.
Taiwan Semiconductor Manufacturing has raised its dividend payment by an average of 0.1%per year over the last three years. Taiwan Semiconductor Manufacturing has a dividend payout ratio of 28.2% meaning its dividend is sufficiently covered by earnings. Equities analysts expect Taiwan Semiconductor Manufacturing to earn $11.03 per share next year, which means the company should continue to be able to cover its $3.05 annual dividend with an expected future payout ratio of 27.7%.
Taiwan Semiconductor Manufacturing Stock Up 3.4%
TSM traded up $12.39 during trading on Wednesday, hitting $374.30. The company had a trading volume of 15,299,498 shares, compared to its average volume of 15,159,281. The firm’s 50-day moving average price is $317.26 and its 200 day moving average price is $286.39. The company has a market capitalization of $1.94 trillion, a PE ratio of 35.15, a PEG ratio of 0.99 and a beta of 1.31. The company has a quick ratio of 2.47, a current ratio of 2.69 and a debt-to-equity ratio of 0.19. Taiwan Semiconductor Manufacturing has a one year low of $134.25 and a one year high of $379.58.
About Taiwan Semiconductor Manufacturing
Taiwan Semiconductor Manufacturing Company (TSMC) is a leading pure-play semiconductor foundry that provides wafer fabrication and related services to the global semiconductor industry. Founded in 1987 by Morris Chang and headquartered in Hsinchu, Taiwan, TSMC manufactures integrated circuits on behalf of fabless and integrated device manufacturers, offering contract chip production across a broad set of technologies and products.
TSMC’s service offering covers logic and mixed-signal process technologies, specialty processes for radio-frequency, power management and embedded memory, and advanced nodes used in mobile, high-performance computing and AI applications.
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