Short Interest in BE Semiconductor Industries NV (OTCMKTS:BESIY) Expands By 188.5%

BE Semiconductor Industries NV (OTCMKTS:BESIY) was the recipient of a significant increase in short interest during the month of January. As of January 15th, there was short interest totaling 4,556 shares, an increase of 188.5% from the December 31st total of 1,579 shares. Based on an average daily volume of 5,828 shares, the short-interest ratio is presently 0.8 days. Based on an average daily volume of 5,828 shares, the short-interest ratio is presently 0.8 days.

BE Semiconductor Industries Price Performance

Shares of OTCMKTS:BESIY opened at $203.19 on Thursday. The company has a 50 day moving average of $169.90 and a 200-day moving average of $156.18. The company has a quick ratio of 5.02, a current ratio of 5.75 and a debt-to-equity ratio of 1.46. BE Semiconductor Industries has a twelve month low of $88.02 and a twelve month high of $210.76.

Analyst Ratings Changes

Several equities analysts have recently commented on BESIY shares. Kepler Capital Markets lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, January 9th. Needham & Company LLC upgraded BE Semiconductor Industries to a “buy” rating in a research note on Tuesday, January 6th. Deutsche Bank Aktiengesellschaft reiterated a “buy” rating on shares of BE Semiconductor Industries in a research note on Wednesday, October 15th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 13th. Finally, Sanford C. Bernstein reiterated an “outperform” rating on shares of BE Semiconductor Industries in a research report on Sunday, January 4th. Five analysts have rated the stock with a Buy rating and six have given a Hold rating to the stock. Based on data from MarketBeat, BE Semiconductor Industries presently has a consensus rating of “Hold”.

About BE Semiconductor Industries

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.