SEI High Yield Bond & Alternative Credit ETF (LEND) to Issue Dividend of $0.12 on September 4th

SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND) declared a dividend on Wednesday, September 2nd. Stockholders of record on Thursday, September 3rd will be paid a dividend of 0.1206 per share on Friday, September 4th. The ex-dividend date of this dividend is Thursday, September 3rd.

SEI High Yield Bond & Alternative Credit ETF Trading Down 0.2%

Shares of NASDAQ LEND opened at $24.83 on Friday. SEI High Yield Bond & Alternative Credit ETF has a 52 week low of $24.79 and a 52 week high of $25.29. The firm has a 50-day moving average price of $24.97 and a 200 day moving average price of $21.15.