Micron Technology, Inc. (MU) to Issue Quarterly Dividend of $0.15 on April 15th

Micron Technology, Inc. (NASDAQ:MU) announced a quarterly dividend on Wednesday, March 18th. Stockholders of record on Monday, March 30th will be paid a dividend of 0.15 per share by the semiconductor manufacturer on Wednesday, April 15th. This represents a c) dividend on an annualized basis and a dividend yield of 0.2%. The ex-dividend date is Monday, March 30th. This is a 30.4% increase from Micron Technology’s previous quarterly dividend of $0.12.

Micron Technology has a payout ratio of 5.4% meaning its dividend is sufficiently covered by earnings. Analysts expect Micron Technology to earn $10.67 per share next year, which means the company should continue to be able to cover its $0.60 annual dividend with an expected future payout ratio of 5.6%.

Micron Technology Stock Up 0.5%

Shares of MU opened at $357.22 on Friday. The stock has a 50 day moving average price of $406.20 and a 200 day moving average price of $291.86. Micron Technology has a one year low of $61.54 and a one year high of $471.34. The company has a debt-to-equity ratio of 0.13, a quick ratio of 2.32 and a current ratio of 2.90. The stock has a market capitalization of $402.85 billion, a price-to-earnings ratio of 16.87 and a beta of 1.50.

About Micron Technology

Micron Technology, Inc is a global semiconductor company that designs and manufactures memory and storage solutions. Its product portfolio includes dynamic random-access memory (DRAM), NAND flash memory, solid-state drives (SSDs), memory modules and embedded memory solutions for a wide range of computing and electronic devices. Micron supplies components used in data centers, enterprise and cloud infrastructure, client computing, mobile devices, automotive systems and industrial applications, and also markets consumer-facing products under the Crucial brand.

Founded in 1978 and headquartered in Boise, Idaho, Micron has grown into an international manufacturer with research, development and production facilities across multiple regions.