Financial Review: Siliconware Precision Industries (SPIL) vs. ChipMOS Technologies (IMOS)
ChipMOS Technologies (NASDAQ:IMOS) and Siliconware Precision Industries (NASDAQ:SPIL) are both computer and technology companies, but which is the superior stock? We will contrast the two companies based on the strength of their valuation, risk, earnings, institutional ownership, profitability, analyst recommendations and dividends.
This is a summary of recent recommendations and price targets for ChipMOS Technologies and Siliconware Precision Industries, as reported by MarketBeat.
|Sell Ratings||Hold Ratings||Buy Ratings||Strong Buy Ratings||Rating Score|
|Siliconware Precision Industries||0||0||0||0||N/A|
Institutional and Insider Ownership
6.1% of ChipMOS Technologies shares are held by institutional investors. Comparatively, 2.7% of Siliconware Precision Industries shares are held by institutional investors. 14.3% of Siliconware Precision Industries shares are held by company insiders. Strong institutional ownership is an indication that large money managers, endowments and hedge funds believe a stock is poised for long-term growth.
Valuation and Earnings
This table compares ChipMOS Technologies and Siliconware Precision Industries’ top-line revenue, earnings per share (EPS) and valuation.
|Gross Revenue||Price/Sales Ratio||Net Income||Earnings Per Share||Price/Earnings Ratio|
|ChipMOS Technologies||$603.80 million||1.01||$36.00 million||N/A||N/A|
|Siliconware Precision Industries||N/A||N/A||N/A||N/A||N/A|
ChipMOS Technologies has higher revenue and earnings than Siliconware Precision Industries.
ChipMOS Technologies pays an annual dividend of $0.16 per share and has a dividend yield of 1.0%. Siliconware Precision Industries pays an annual dividend of $0.21 per share and has a dividend yield of 2.4%. Siliconware Precision Industries has increased its dividend for 3 consecutive years. Siliconware Precision Industries is clearly the better dividend stock, given its higher yield and longer track record of dividend growth.
This table compares ChipMOS Technologies and Siliconware Precision Industries’ net margins, return on equity and return on assets.
|Net Margins||Return on Equity||Return on Assets|
|Siliconware Precision Industries||N/A||N/A||N/A|
ChipMOS Technologies beats Siliconware Precision Industries on 5 of the 8 factors compared between the two stocks.
ChipMOS Technologies Company Profile
ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision integrated circuits, and related assembly and testing services. It provides a range of back-end assembly and test services, including engineering test, wafer probing and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other flat-panel display driver semiconductors. The company's semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as flat-panel displays. It serves customers in Taiwan, Japan, Korea, Hong Kong, and the United States. The company was founded in 1997 and is headquartered in Hsinchu, Taiwan.
Siliconware Precision Industries Company Profile
Siliconware Precision Industries Co., Ltd. provides semiconductor packaging and testing services in the United States, China, Taiwan, Europe, and internationally. It provides packaging and testing solutions, including advanced packages, substrate packages, and lead-frame packages, as well as testing for logic and mixed signal devices to measure and ensure the performance, functionality, and reliability of packaged semiconductor devices. The company also offers turnkey services; and flip-chip and wafer bumping services. Its substrate packages category employs the ball grid array design, which utilizes a laminated substrate and places the electrical connections on the bottom of the package; and lead-frame packages that are characterized by a semiconductor chip encapsulated in a plastic molding compound with metal leads on the perimeter. The company's testing and other services include wafer probing that involves sorting the processed wafer for defects; final testing services for logic and mixed signal and RF integrated circuit packages; burn in services for testing products; and other testing services, such as system-level testing, lead/ball scanner, marking, and tape and reel services. It serves customers in the personal computer, communications, consumer integrated circuits, and non-commodity memory semiconductor markets. The company has a strategic alliance with Tsinghua Unigroup Ltd. Siliconware Precision Industries Co., Ltd. was founded in 1984 and is headquartered in Taichung, Taiwan.
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