Disco (OTCMKTS:DSCSY) Stock Jumps 4.4% – What’s Next?

Disco Corp (OTCMKTS:DSCSY)’s stock price shot up 4.4% during mid-day trading on Tuesday. The company traded as high as $36.80 and last traded at $36.70. 2,981 shares changed hands during mid-day trading, a decline of 99% from the average session volume of 294,320 shares. The stock had previously closed at $35.15.

Analysts Set New Price Targets

Separately, Jefferies Financial Group upgraded Disco from a “hold” rating to a “buy” rating in a report on Monday, July 27th. One investment analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the company’s stock. Based on data from MarketBeat, the stock currently has an average rating of “Moderate Buy”.

Disco Stock Up 5.7%

The company has a market cap of $40.32 billion, a price-to-earnings ratio of 42.71 and a beta of 1.54. The company’s fifty day moving average price is $36.57 and its two-hundred day moving average price is $41.94.

Disco (OTCMKTS:DSCSY) last issued its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. The company had revenue of $717.28 million during the quarter. Disco had a net margin of 31.65% and a return on equity of 26.03%. On average, equities research analysts predict that Disco Corp will post 1.11 earnings per share for the current fiscal year.

Institutional Trading of Disco

A hedge fund recently bought a new stake in Disco stock. Azimuth Capital Investment Management LLC purchased a new stake in Disco Corp (OTCMKTS:DSCSY) during the second quarter, according to its most recent 13F filing with the Securities & Exchange Commission. The fund purchased 237,250 shares of the company’s stock, valued at approximately $11,862,000. Institutional investors own 0.03% of the company’s stock.

About Disco

DISCO Corporation is a Japan-based manufacturer of precision equipment and tools used in semiconductor and electronic-component manufacturing. The company’s products support the processing of silicon and other hard, brittle materials, including wafer thinning, dicing, grinding, polishing and other precision separation processes.

Its product portfolio includes semiconductor manufacturing equipment, precision processing tools such as diamond wheels and blades, and related equipment and consumables.