Disco (OTCMKTS:DSCSY) Reaches New 1-Year High – Here’s Why

Shares of Disco Corp (OTCMKTS:DSCSYGet Free Report) hit a new 52-week high during mid-day trading on Monday . The company traded as high as $53.30 and last traded at $52.95, with a volume of 3574 shares changing hands. The stock had previously closed at $50.72.

Analysts Set New Price Targets

Separately, Zacks Research cut shares of Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One investment analyst has rated the stock with a Strong Buy rating and one has issued a Hold rating to the company’s stock. According to MarketBeat, Disco currently has a consensus rating of “Buy”.

Get Our Latest Stock Report on DSCSY

Disco Price Performance

The stock has a market cap of $54.36 billion, a P/E ratio of 61.11 and a beta of 1.54. The firm’s fifty day moving average price is $44.65 and its two-hundred day moving average price is $41.12.

Disco (OTCMKTS:DSCSYGet Free Report) last released its quarterly earnings results on Wednesday, April 22nd. The company reported $0.25 earnings per share for the quarter. The firm had revenue of $848.13 million for the quarter, compared to analysts’ expectations of $771.53 million. Disco had a net margin of 30.95% and a return on equity of 25.27%. On average, research analysts expect that Disco Corp will post 1.07 earnings per share for the current fiscal year.

About Disco

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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