Disco Corp (OTCMKTS:DSCSY – Get Free Report) saw a large decline in short interest in the month of August. As of August 14th, there was short interest totaling 15,246 shares, a decline of 32.3% from the July 30th total of 22,522 shares. Based on an average trading volume of 456,589 shares, the days-to-cover ratio is presently 0.0 days. Approximately 0.0% of the shares of the company are sold short.
Disco Stock Down 0.8%
DSCSY stock opened at $35.85 on Tuesday. The business has a 50-day simple moving average of $41.23 and a 200 day simple moving average of $43.80. Disco has a 52 week low of $24.94 and a 52 week high of $58.00. The company has a market cap of $38.90 billion, a PE ratio of 41.21 and a beta of 1.55.
Disco (OTCMKTS:DSCSY – Get Free Report) last released its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.03%. The business had revenue of $717.28 million during the quarter. On average, analysts anticipate that Disco will post 1.05 EPS for the current fiscal year.
Institutional Investors Weigh In On Disco
Analysts Set New Price Targets
Several equities analysts have commented on DSCSY shares. Jefferies Financial Group upgraded shares of Disco from a “hold” rating to a “buy” rating in a report on Monday, July 27th. Zacks Research cut shares of Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One equities research analyst has rated the stock with a Buy rating and one has issued a Hold rating to the company’s stock. According to MarketBeat.com, the stock currently has an average rating of “Moderate Buy”.
Get Our Latest Research Report on Disco
About Disco
Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.
Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.
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