Disco Corp (OTCMKTS:DSCSY) Short Interest Down 90.9% in July

Disco Corp (OTCMKTS:DSCSY) was the target of a large drop in short interest in the month of July. As of July 15th, there was short interest totaling 10,600 shares, a drop of 90.9% from the June 30th total of 115,925 shares. Approximately 0.0% of the shares of the stock are short sold. Based on an average daily trading volume, of 720,554 shares, the days-to-cover ratio is currently 0.0 days.

Analyst Ratings Changes

Separately, Zacks Research cut Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. One investment analyst has rated the stock with a Hold rating, Based on data from MarketBeat, the company currently has an average rating of “Hold”.

Disco Stock Down 6.1%

Shares of DSCSY stock opened at $36.37 on Friday. The company has a market capitalization of $39.46 billion, a P/E ratio of 41.81 and a beta of 1.50. Disco has a 12-month low of $24.94 and a 12-month high of $58.00. The firm has a 50-day moving average price of $45.07 and a 200 day moving average price of $44.26.

Disco (OTCMKTS:DSCSY) last issued its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share for the quarter. The firm had revenue of $717.28 million for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.08%. As a group, research analysts expect that Disco will post 1.05 earnings per share for the current year.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.