BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s stock price reached a new 52-week high during trading on Thursday . The company traded as high as $315.00 and last traded at $314.78, with a volume of 670 shares. The stock had previously closed at $308.3101.
Wall Street Analysts Forecast Growth
BESIY has been the topic of a number of research analyst reports. Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday. Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a report on Friday, May 15th. Finally, Zacks Research raised BE Semiconductor Industries to a “strong-buy” rating in a report on Thursday, April 23rd. One equities research analyst has rated the stock with a Strong Buy rating, five have assigned a Buy rating and four have assigned a Hold rating to the stock. According to MarketBeat, the company has an average rating of “Moderate Buy”.
Read Our Latest Stock Analysis on BESIY
BE Semiconductor Industries Trading Down 1.4%
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last announced its quarterly earnings results on Thursday, April 23rd. The technology company reported $0.76 earnings per share (EPS) for the quarter, hitting the consensus estimate of $0.76. The business had revenue of $216.51 million for the quarter, compared to the consensus estimate of $220.77 million. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%. Equities research analysts forecast that BE Semiconductor Industries NV will post 4.46 earnings per share for the current year.
About BE Semiconductor Industries
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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