ASE Technology (ASX) Projected to Announce Earnings on Thursday

ASE Technology (NYSE:ASX) is expected to be announcing its Q3 2026 results before the market opens on Thursday, October 29th. Analysts expect ASE Technology to announce earnings of $0.34 per share and revenue of $7.30 billion for the quarter. Individuals are encouraged to explore the company’s upcoming Q3 2026 earnings summary page for the latest details on the call scheduled for Thursday, October 29, 2026 at 3:00 AM ET.

ASE Technology (NYSE:ASX) last released its quarterly earnings results on Thursday, July 30th. The semiconductor company reported $0.29 EPS for the quarter, topping the consensus estimate of $0.23 by $0.06. The firm had revenue of $81.66 million for the quarter, compared to analysts’ expectations of $5.96 billion. On average, analysts expect ASE Technology to post $1.26 EPS for the current fiscal year and $2.09 EPS for the next fiscal year.

ASE Technology Stock Up 5.5%

Shares of NYSE ASX opened at $42.09 on Wednesday. ASE Technology has a twelve month low of $13.18 and a twelve month high of $47.93. The stock has a fifty day simple moving average of $41.09 and a 200-day simple moving average of $32.84.

Wall Street Analysts Forecast Growth

Several research firms recently issued reports on ASX. Weiss Ratings raised ASE Technology from a “hold (c+)” rating to a “buy (b)” rating in a research note on Friday, October 9th. Wall Street Zen downgraded ASE Technology from a “buy” rating to a “hold” rating in a research report on Saturday, September 19th. Finally, Zacks Research raised ASE Technology from a “hold” rating to a “strong-buy” rating in a research report on Tuesday, September 22nd. One equities research analyst has rated the stock with a Strong Buy rating and two have assigned a Buy rating to the company’s stock. According to MarketBeat, ASE Technology has a consensus rating of “Buy”.

ASE Technology Company Profile

ASE Technology Holding Co, Ltd. is a Taiwan-based provider of semiconductor manufacturing services. Through its subsidiaries, the company offers outsourced semiconductor assembly and test services, helping chip designers and manufacturers package, assemble and evaluate integrated circuits after wafer fabrication.

Its services include wafer probing, wafer bumping, semiconductor packaging, final testing and advanced packaging technologies such as flip-chip, system-in-package and fan-out solutions.