Disco (OTCMKTS:DSCSY) Shares Gap Down – Should You Sell?

Disco Corp (OTCMKTS:DSCSY)’s stock price gapped down before the market opened on Friday. The stock had previously closed at $32.43, but opened at $30.69. Disco shares last traded at $30.8250, with a volume of 46,108 shares changing hands.

Wall Street Analysts Forecast Growth

A number of research analysts recently commented on the company. Jefferies Financial Group raised Disco from a “hold” rating to a “buy” rating in a report on Monday, July 27th. Zacks Research upgraded shares of Disco from a “hold” rating to a “strong-buy” rating in a research report on Monday, October 5th. One equities research analyst has rated the stock with a Strong Buy rating and one has issued a Buy rating to the stock. Based on data from MarketBeat, the stock presently has a consensus rating of “Strong Buy”.

Disco Stock Down 3.8%

The firm has a 50 day simple moving average of $36.04 and a 200-day simple moving average of $41.25. The company has a market cap of $33.86 billion, a PE ratio of 35.87 and a beta of 1.56.

Disco (OTCMKTS:DSCSY) last announced its earnings results on Thursday, October 22nd. The company reported $0.27 earnings per share (EPS) for the quarter. Disco had a return on equity of 26.03% and a net margin of 31.65%. The company had revenue of $897.04 million for the quarter. As a group, equities analysts anticipate that Disco Corp will post 1.11 EPS for the current year.

Institutional Trading of Disco

An institutional investor recently bought a new stake in Disco stock. Azimuth Capital Investment Management LLC purchased a new stake in Disco Corp (OTCMKTS:DSCSY) in the 2nd quarter, according to the company in its most recent 13F filing with the SEC. The fund purchased 237,250 shares of the company’s stock, valued at approximately $11,862,000. 0.03% of the stock is owned by institutional investors and hedge funds.

Disco Company Profile

DISCO Corporation is a Japan-based manufacturer of precision equipment and tools used in the semiconductor and electronics industries. The company develops and produces systems for wafer dicing, grinding and polishing, as well as related consumables such as diamond wheels and other cutting tools.

Its products are used to separate semiconductor wafers into individual chips and to shape, thin and finish semiconductor materials with high precision. DISCO also provides equipment, tools and technical support for applications involving silicon, compound semiconductors and other electronic materials.

Founded in 1937 and headquartered in Tokyo, DISCO serves customers internationally through a global network of sales, service and production operations.