BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s stock price gapped down before the market opened on Tuesday. The stock had previously closed at $229.42, but opened at $219.23. BE Semiconductor Industries shares last traded at $218.91, with a volume of 1,072 shares.
Analyst Ratings Changes
Several equities research analysts have recently weighed in on the company. Morgan Stanley reissued an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, September 8th. Berenberg Bank raised BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a report on Tuesday, August 4th. Finally, Zacks Research lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, September 25th. One equities research analyst has rated the stock with a Strong Buy rating, five have issued a Buy rating and three have assigned a Hold rating to the company. According to data from MarketBeat, the stock has an average rating of “Moderate Buy”.
Check Out Our Latest Stock Report on BE Semiconductor Industries
BE Semiconductor Industries Stock Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last issued its quarterly earnings data on Thursday, July 23rd. The technology company reported $1.29 earnings per share (EPS) for the quarter, missing analysts’ consensus estimates of $1.30 by ($0.01). The business had revenue of $290.52 million during the quarter, compared to the consensus estimate of $285.58 million. BE Semiconductor Industries had a net margin of 28.42% and a return on equity of 46.44%. On average, analysts predict that BE Semiconductor Industries NV will post 4.83 EPS for the current fiscal year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries N.V. (Besi) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to assemble, package, and finish semiconductor devices after wafer fabrication.
Besi’s product portfolio includes die-attach equipment, packaging systems, molding and singulation equipment, plating systems, and related solutions for advanced semiconductor packaging. Its technologies support applications such as flip-chip, wafer-level packaging, thermo-compression bonding, and hybrid bonding, which are used in electronics, communications, automotive, computing, and other semiconductor markets.
Founded in 1995 and headquartered in Duiven, the Netherlands, Besi serves semiconductor manufacturers and assembly and test providers worldwide.
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