Disco (OTCMKTS:DSCSY) Shares Gap Down – Here’s Why

Disco Corp (OTCMKTS:DSCSY)’s share price gapped down prior to trading on Wednesday . The stock had previously closed at $41.10, but opened at $39.00. Disco shares last traded at $38.57, with a volume of 4,203 shares trading hands.

Wall Street Analysts Forecast Growth

Several research analysts have commented on DSCSY shares. Zacks Research downgraded Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. Jefferies Financial Group upgraded shares of Disco from a “hold” rating to a “buy” rating in a research note on Monday, July 27th. One equities research analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the company’s stock. According to data from MarketBeat.com, Disco has an average rating of “Moderate Buy”.

Disco Trading Down 2.1%

The firm has a market capitalization of $40.12 billion, a price-to-earnings ratio of 42.51 and a beta of 1.55. The firm’s 50-day moving average is $43.44 and its 200 day moving average is $44.13.

Disco (OTCMKTS:DSCSY) last released its quarterly earnings results on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. The firm had revenue of $717.28 million during the quarter. Disco had a net margin of 31.65% and a return on equity of 26.03%. Analysts predict that Disco Corp will post 1.05 EPS for the current year.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.