Disco (OTCMKTS:DSCSY) Shares Gap Up – What’s Next?

Disco Corp (OTCMKTS:DSCSY) shares gapped up prior to trading on Monday . The stock had previously closed at $37.61, but opened at $39.47. Disco shares last traded at $39.53, with a volume of 38,666 shares changing hands.

Analyst Upgrades and Downgrades

DSCSY has been the subject of a number of recent analyst reports. Zacks Research cut Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. Jefferies Financial Group upgraded Disco from a “hold” rating to a “buy” rating in a research report on Monday, July 27th. One analyst has rated the stock with a Buy rating and one has given a Hold rating to the company’s stock. According to MarketBeat, the stock presently has an average rating of “Moderate Buy”.

Disco Trading Up 3.5%

The stock has a market cap of $42.24 billion, a price-to-earnings ratio of 44.76 and a beta of 1.55. The firm’s 50-day moving average is $44.14 and its two-hundred day moving average is $44.34.

Disco (OTCMKTS:DSCSY) last posted its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. Disco had a return on equity of 26.03% and a net margin of 31.65%.The company had revenue of $717.28 million for the quarter. On average, analysts predict that Disco Corp will post 1.05 earnings per share for the current year.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.