Disco (OTCMKTS:DSCSY) Shares Down 11.2% – Time to Sell?

Disco Corp (OTCMKTS:DSCSYGet Free Report)’s share price fell 11.2% during mid-day trading on Wednesday . The stock traded as low as $41.82 and last traded at $42.77. 24,520 shares were traded during trading, a decline of 92% from the average daily volume of 300,672 shares. The stock had previously closed at $48.17.

Wall Street Analyst Weigh In

Separately, Zacks Research lowered shares of Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One equities research analyst has rated the stock with a Strong Buy rating and one has assigned a Hold rating to the company. Based on data from MarketBeat, the stock presently has a consensus rating of “Buy”.

View Our Latest Stock Analysis on DSCSY

Disco Trading Down 3.1%

The stock has a market capitalization of $45.39 billion, a P/E ratio of 51.02 and a beta of 1.50. The stock’s fifty day moving average price is $46.34 and its two-hundred day moving average price is $43.28.

Disco (OTCMKTS:DSCSYGet Free Report) last released its earnings results on Wednesday, April 22nd. The company reported $0.25 EPS for the quarter. Disco had a net margin of 30.95% and a return on equity of 25.27%. The company had revenue of $848.13 million for the quarter, compared to analyst estimates of $771.53 million. As a group, analysts expect that Disco Corp will post 1.05 earnings per share for the current fiscal year.

About Disco

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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