BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s share price reached a new 52-week high during mid-day trading on Monday . The company traded as high as $374.33 and last traded at $370.2150, with a volume of 799 shares trading hands. The stock had previously closed at $352.92.
Analyst Upgrades and Downgrades
BESIY has been the subject of a number of research analyst reports. Deutsche Bank Aktiengesellschaft restated a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Zacks Research raised shares of BE Semiconductor Industries to a “strong-buy” rating in a research note on Thursday, April 23rd. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, May 19th. Finally, Berenberg Bank upgraded BE Semiconductor Industries to a “hold” rating in a report on Monday, February 23rd. One research analyst has rated the stock with a Strong Buy rating, five have issued a Buy rating and four have given a Hold rating to the company’s stock. According to data from MarketBeat, the company currently has a consensus rating of “Moderate Buy”.
Get Our Latest Stock Analysis on BE Semiconductor Industries
BE Semiconductor Industries Trading Down 0.1%
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last announced its earnings results on Thursday, April 23rd. The technology company reported $0.76 earnings per share (EPS) for the quarter, hitting the consensus estimate of $0.76. BE Semiconductor Industries had a net margin of 24.02% and a return on equity of 38.42%. The company had revenue of $216.51 million for the quarter, compared to analysts’ expectations of $220.77 million. On average, research analysts predict that BE Semiconductor Industries NV will post 4.45 EPS for the current fiscal year.
About BE Semiconductor Industries
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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