Lam Research Corporation Declares Quarterly Dividend of $0.26 (NASDAQ:LRCX)

Lam Research Corporation (NASDAQ:LRCX) announced a quarterly dividend on Thursday, May 21st. Stockholders of record on Wednesday, June 17th will be paid a dividend of 0.26 per share by the semiconductor company on Wednesday, July 8th. This represents a c) annualized dividend and a dividend yield of 0.3%. The ex-dividend date is Wednesday, June 17th.

Lam Research has raised its dividend by an average of 0.1%per year over the last three years and has raised its dividend every year for the last 10 years. Lam Research has a dividend payout ratio of 25.9% indicating that its dividend is sufficiently covered by earnings. Analysts expect Lam Research to earn $7.74 per share next year, which means the company should continue to be able to cover its $1.04 annual dividend with an expected future payout ratio of 13.4%.

Lam Research Trading Up 3.5%

Shares of LRCX stock opened at $302.24 on Friday. The company has a 50 day moving average of $252.34 and a 200-day moving average of $214.71. The company has a quick ratio of 1.77, a current ratio of 2.54 and a debt-to-equity ratio of 0.35. Lam Research has a 12-month low of $79.49 and a 12-month high of $303.18. The firm has a market cap of $377.97 billion, a P/E ratio of 57.03, a PEG ratio of 2.42 and a beta of 1.81.

Lam Research (NASDAQ:LRCX) last released its quarterly earnings data on Wednesday, April 22nd. The semiconductor company reported $1.47 EPS for the quarter, topping the consensus estimate of $1.36 by $0.11. The company had revenue of $5.84 billion during the quarter, compared to the consensus estimate of $5.70 billion. Lam Research had a net margin of 30.94% and a return on equity of 66.21%. Lam Research’s revenue for the quarter was up 23.8% on a year-over-year basis. During the same period last year, the firm earned $1.04 EPS. Lam Research has set its Q4 2026 guidance at 1.500-1.800 EPS. Sell-side analysts anticipate that Lam Research will post 5.67 earnings per share for the current year.

Key Lam Research News

Here are the key news stories impacting Lam Research this week:

• Positive Sentiment: Lam Research opened a new research lab in Salzburg, Austria, to advance chip packaging technology that can increase chip density and lower costs, supporting its growth strategy in AI-related semiconductor manufacturing. Reuters article on Austria lab
• Positive Sentiment: Lam Research said it is adding sensing and AI capabilities to its manufacturing tools while expanding operations in Arizona and California, which could improve product performance and strengthen demand from chipmakers. Reuters article on AI tools and expansion
• Positive Sentiment: Morgan Stanley upgraded Lam Research to Overweight and raised its price target, while Bernstein also lifted its target, reflecting higher expectations for wafer fabrication equipment spending and AI-related demand. Bernstein price target article
• Positive Sentiment: Lam Research raised its WFE outlook amid strong AI chip demand, and analysts see that backdrop supporting revenue and earnings growth in the near term. Zacks article on WFE outlook
• Positive Sentiment: The company also declared a quarterly dividend of $0.26 per share, which signals financial strength and may appeal to income-focused investors. Dividend press release
• Neutral Sentiment: Recent technical coverage noted that LRCX moved above its 20-day moving average, which can reinforce existing bullish momentum but does not by itself change the company’s fundamentals. Zacks technical article
• Neutral Sentiment: Some commentary also compared Lam Research with Applied Materials and highlighted valuation differences, but this is more of an industry debate than a direct catalyst for LRCX. Zacks comparison article

Lam Research Company Profile

Lam Research Corporation (NASDAQ: LRCX) is a global supplier of wafer fabrication equipment and services to the semiconductor industry. Founded in 1980 by David K. Lam and headquartered in Fremont, California, the company develops and manufactures systems used in multiple stages of semiconductor device production, including thin film deposition, plasma etch, wafer cleaning and related process modules and automation.

Lam’s product portfolio covers core process technologies employed by logic and memory manufacturers, with equipment designed to support advanced-node patterning, 3D NAND and other emerging device architectures.