BE Semiconductor Industries (OTCMKTS:BESIY) Reaches New 52-Week High – Here’s Why

Shares of BE Semiconductor Industries NV (OTCMKTS:BESIYGet Free Report) hit a new 52-week high during trading on Wednesday . The company traded as high as $239.37 and last traded at $238.00, with a volume of 1760 shares. The stock had previously closed at $224.50.

Wall Street Analysts Forecast Growth

A number of analysts recently commented on BESIY shares. Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a research note on Monday, February 23rd. Kepler Capital Markets lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, January 9th. Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 13th. Citigroup reaffirmed a “neutral” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 20th. Finally, Needham & Company LLC raised BE Semiconductor Industries to a “buy” rating in a research note on Tuesday, January 6th. Five investment analysts have rated the stock with a Buy rating and six have given a Hold rating to the company. According to MarketBeat.com, the stock currently has a consensus rating of “Hold”.

Check Out Our Latest Report on BE Semiconductor Industries

BE Semiconductor Industries Price Performance

The company has a debt-to-equity ratio of 1.22, a current ratio of 5.55 and a quick ratio of 4.88. The firm has a market cap of $17.40 billion, a PE ratio of 128.31 and a beta of 1.78. The firm has a 50-day simple moving average of $210.56 and a 200 day simple moving average of $181.20.

BE Semiconductor Industries Company Profile

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.

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