NXP Semiconductors N.V. (NASDAQ:NXPI – Get Free Report) declared a quarterly dividend on Thursday, March 12th. Shareholders of record on Wednesday, March 25th will be paid a dividend of 1.014 per share by the semiconductor provider on Thursday, April 9th. This represents a c) annualized dividend and a yield of 2.1%. The ex-dividend date of this dividend is Wednesday, March 25th.
NXP Semiconductors has increased its dividend by an average of 0.2%per year over the last three years. NXP Semiconductors has a dividend payout ratio of 29.4% indicating that its dividend is sufficiently covered by earnings. Research analysts expect NXP Semiconductors to earn $12.53 per share next year, which means the company should continue to be able to cover its $4.05 annual dividend with an expected future payout ratio of 32.3%.
NXP Semiconductors Price Performance
NXPI opened at $191.22 on Friday. The firm’s fifty day moving average price is $229.62 and its two-hundred day moving average price is $222.09. The company has a market capitalization of $48.32 billion, a price-to-earnings ratio of 24.08, a P/E/G ratio of 0.90 and a beta of 1.45. NXP Semiconductors has a 1 year low of $148.09 and a 1 year high of $256.36. The company has a debt-to-equity ratio of 1.09, a current ratio of 2.05 and a quick ratio of 1.38.
NXP Semiconductors Company Profile
NXP Semiconductors N.V. is a global semiconductor company headquartered in Eindhoven, the Netherlands, that designs and supplies mixed-signal and standard product solutions for a broad range of end markets. The company focuses on enabling secure connections and infrastructure for embedded applications, developing technologies used across automotive, industrial and Internet of Things (IoT), mobile, and communication infrastructure segments. NXP’s offerings target customers that require reliable, secure, and high-performance semiconductor components for connected devices and systems.
Product lines include microcontrollers and application processors, secure elements and authentication technologies, RF and high-power analog components, connectivity solutions, and vehicle networking and infotainment systems.
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