BE Semiconductor Industries (OTCMKTS:BESIY) Stock Rating Upgraded by Berenberg Bank

Posted by Hanz Christensen on Feb 26th, 2026

BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) was upgraded by Berenberg Bank to a “hold” rating in a research report issued on Monday,Zacks.com reports.

Several other research analysts also recently weighed in on BESIY. Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 13th. Kepler Capital Markets cut shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, January 9th. Needham & Company LLC raised shares of BE Semiconductor Industries to a “buy” rating in a report on Tuesday, January 6th. Citigroup reiterated a “neutral” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 20th. Finally, Sanford C. Bernstein restated an “outperform” rating on shares of BE Semiconductor Industries in a research report on Sunday, January 4th. Five analysts have rated the stock with a Buy rating and six have assigned a Hold rating to the company. According to MarketBeat.com, BE Semiconductor Industries presently has a consensus rating of “Hold”.

View Our Latest Analysis on BESIY

BE Semiconductor Industries Stock Up 1.0%

OTCMKTS:BESIY opened at $234.99 on Monday. The company has a debt-to-equity ratio of 1.46, a quick ratio of 5.02 and a current ratio of 5.75. BE Semiconductor Industries has a 52 week low of $88.02 and a 52 week high of $235.17. The stock’s 50-day moving average price is $190.83 and its 200-day moving average price is $165.26.

BE Semiconductor Industries Company Profile

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.